东莞市玮孚电子科技有限公司

专业生产：单双面铝基板、2~12层FR4多层电路板

地址：中国东莞松山湖科技产业园北部工业城中小科技企业园第5栋
电话：(86) 769 2289 9822，2289 9838
传真：(86) 769 2289 9823
邮箱：sales@viafine.com

制程能力：

Layers:	1 to 12 Layers
Base Materials:	XPC FR1 FR2 CEM1 CEM3 , FR4,  High TG FR4
Base Copper Thickness:	1OZ oz. to 3 oz.
BoardThickness:	0.4mm-3.2mm
Maximum Panel Size:	406mm x 610mm
Minimum Hole Diameter:	0.3mm
PTH Hole Tolerance:	0.05mm
Aspect Ratio:	6:1
Blind or Buried Via:	no
Minimum Line Width:	0.1mm
Minimum Line Spacing:	0.1mm
Minimum Bonding Pitch:	0.127mm
Minimum SMT Pitch:	0.40mm " (center to center)
Mechanical Fabrication:	Minimum Hole registration tolerance (NPTH): +/-0.076 Minimum Hole registration tolerance (PTH): +/-0.076mm Minimum Pattern registration tolerance: +/-0.076mm Minimum S/M registration tolerance (LPI): +/-0.076mm Minimum Annular ring: +/-0.1mm( artwork) Minimum S/M bridge (LPI): 0.1mm Plated gold thickness: 0.01um – 0.025um Immersion gold thickness: 0.025um -- 0.2um
Electrical Testing:	Voltage: 24V - 300V ontinuity:5 - 100Ohms Twist and Warp: Less than 1%

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